Reliable FPC. Reliable Assembly. One Partner.
From single-layer flex to multi-layer rigid-flex, end-to-end FPC manufacturing engineered to your stack-up — built, tested, and assembled under one roof.
Local Coverage. Global Reach.
Regional teams across Southeast Asia, Europe, and the Americas — supporting customer engineering, commercial coordination, and program alignment worldwide.
Southeast Asia
Commercial coordination, program alignment, and customer-facing engineering response across Southeast Asia and global accounts.
Vtech CircuFlex — Singapore HQEurope
European customer interface for sales coordination, technical liaison, and program alignment across EMEA accounts.
Vtech CircuFlex — EuropeAmericas
North American customer interface for sales coordination, technical liaison, and program alignment across Americas accounts.
Vtech CircuFlex — AmericasFlex Circuits, Engineered to Your Needs.
From simple single-layer interconnects to multi-layer flex with controlled impedance, CircuFlex covers the full range of flexible circuit manufacturing — with in-house process engineering that works to your stack-up, or helps define one if you're early in design.
- Single-sided, double-sided, multi-layer, and rigid-flex constructions
- Polyimide (PI), polyester (PET), and LCP base substrates
- Coverlay (PI / photoimageable), solder mask, and stiffener integration
- ENIG, immersion silver, OSP, ENEPIG surface finishes
- SMT-ready panels with fiducials, tooling holes, and breakaway tabs
- Functional electrical test, AOI inspection, and impedance verification
- End-to-end assembly: SMT, through-hole, and flex-rigid integration
The Right Flex for the Right Job.
Six FPC constructions covering everything from simple sensor interconnects to complex high-density rigid-flex assemblies. Send us your stack-up — or tell us your application and we'll recommend one.
Single-Sided FPC
One conductive copper layer on a polyimide base. Ideal for simple interconnects, sensor lines, and cost-sensitive applications.
PI / Cu / CoverlayDouble-Sided FPC
Two conductive layers with plated through-holes. Higher routing density for compact electronics and signal-integrity applications.
Coverlay / Cu / PI / Cu / CoverlayMulti-Layer FPC
3+ conductive layers laminated with bond-ply. For complex routing, controlled impedance, and shielded high-speed signal paths.
3 to 8+ Cu layersRigid-Flex
Combination of rigid PCB sections joined by flex circuit. Eliminates connectors, reduces failure points, and shrinks 3D enclosures.
FR-4 + PI hybrid laminateAdhesiveless FPC
High-density construction without adhesive layer between Cu and PI. Better thermal performance, finer line/space, and improved flex life.
Sputtered Cu on PI (no adhesive)HDI Flex
High-Density Interconnect with microvias and ultra-fine line/space. For miniaturised, high-pin-count applications like wearables and medical devices.
Laser microvias · 50/50 µm L/SProof of Concept to First Article — in Five Steps.
An integrated process that runs from DFM review through assembly, with quality gates at each handoff.
Align
DFM review on Gerbers, drill files, stack-up — flagged constraints returned within one working day.
Build
In-house tooling, lamination, etching, and coverlay application to your validated stack-up.
Validate
Inline AOI, flying probe and fixture electrical test, optional 100% impedance verification.
Assemble
SMT, through-hole, and flex-rigid integration when assembled FPC modules are required.
Scale
Production ramp from prototype through high-volume series, with material certs and traceability.
Inside the VTECH CircuFlex Floor.
Process coverage across fabrication, drilling, plating, lamination, imaging, inspection, and final assembly — supported by automated cutting, CNC drilling, target punching, electroplating, and dry-film lamination lines.
Process specification.
Quoted to your drawing. Use the table below as a starting reference; tighter or wider parameters available on review.
| Parameter | Standard | On request |
|---|---|---|
| Layer count | 1–6 layers | 8+ layers, rigid-flex |
| Base material | Polyimide / Polyester | LCP, adhesiveless |
| Board thickness | 0.065 – 0.28 mm | Customer specification |
| Film thickness | 0.0125 – 0.10 mm | Custom on review |
| Copper foil thickness | 0.009 – 0.10 mm | Up to 3 oz equivalent |
| Min trace / space | 0.05 mm (50 µm) | Finer on review |
| Maximum panel size | 600 × 500 mm | Custom panelisation |
| CNC drilling min hole | 0.20 mm | 0.15 mm |
| Laser drilling min hole | 0.05 mm | Microvia stack |
| Surface finish | Cu / Ni / Au / Sn / OSP | ENEPIG, Immersion Ag, HASL |
| Solder mask / Coverlay | Coverlay + PSR | Photoimageable coverlay |
| Profile method | Punching / CNC routing / Laser | V-groove, die-cut |
| Stiffener | FR-4, PI | Stainless steel, aluminium |
| Test & QC | AOI, electrical open/short, thickness | 100% impedance, HiPot |
| Assembly | SMT, through-hole, value-added | Flex-rigid integration, OEM modules |
Built to Meet Your Quality Team's Expectations.
Process discipline aligned to industry standards, with documentation, traceability, and lot-level inspection records that hold up to audit.
Where CircuFlex performs.
Click any application below to explore the dedicated capability page — with industry-specific specs, qualifications, and use cases.
Wearables & portables →
Compact flex interconnects for fitness trackers, audio devices, AR/VR, and wearable medical sensors.
MedicalMedical devices →
Diagnostic, monitoring, and disposable device interconnects with traceability and biocompatible material options.
AutomotiveAutomotive sensors →
Sensor interconnects, instrument clusters, and ADAS sub-assemblies built to IATF 16949 standards.
IndustrialIndustrial control →
Vibration- and motion-tolerant flex circuits for industrial automation, robotics, and sensor packaging.