Flex circuits for industrial IoT, factory automation, asset-tracking RFID, and process instrumentation. Fine-feature capability for UHF/HF/NFC inlays, thin constructions for embedded sensors, and documentation discipline for industrial qualification programs.
Industrial electronics cover a wide substrate envelope: RFID inlays and tags for asset tracking, thin embedded sensors for process instrumentation, flex interconnects for factory-automation equipment, and compact modules for industrial IoT. CircuFlex supports the full range with fine-feature capability for RFID antennas, thin constructions for embedded sensors, and documentation discipline for industrial qualification.

Industrial FPC programs benefit from one coordinated manufacturing flow — RFID antenna fabrication, thin-film electronics, module interconnects, and validation all under a single process discipline.
Fine conductor geometry supports the antenna designs across UHF, HF, and NFC frequency bands. From high-volume consumer tags to compact embedded industrial RFID.
0.065 mm board thickness and thin-film construction options let sensors embed into harsh environments — pipe monitoring, equipment condition, factory IoT.
600 × 500 mm maximum panel size supports high-volume RFID inlay panelisation for cost-efficient production runs.
Audit file, control plan, FAI, and reliability test coordination — the documentation package industrial SQE teams expect.
PI base film proven in industrial-environment applications — thermal stability, chemical resistance, and long service life.
DFM through electrical test in one coordinated process — reduces supplier handoffs and improves root-cause response time on industrial programs.
Standard capability envelope. Alternative configurations available on request — send your design brief and we’ll respond with the matching process route.
| Minimum trace/space | 0.05 mm |
|---|---|
| Minimum laser drill | 0.05 mm |
| Minimum CNC drill | 0.20 mm |
| Maximum panel size | 600 × 500 mm |
| Build-up | 1 to 6 layers |
| Board thickness | 0.065 – 0.28 mm |
| RFID frequency support | UHF · HF · NFC |
| Base films | Polyimide (PI) · Polyester |
| Surface finishes | Cu · Ni · Au · Sn · OSP |
| Profile methods | Punching · CNC routing · Laser processing |
UHF/HF/NFC inlays and tags for logistics, supply chain, and industrial asset tracking.
Embedded sensor FPC for factory-floor monitoring, condition-based maintenance, and equipment telemetry.
Flex interconnects for robot arm tooling, machine-vision cameras, and automation control systems.
Thin-film sensor FPC for flow, pressure, temperature, and process-parameter monitoring.
RFID-enabled smart packaging and anti-counterfeit authentication tags.
Container-level and parcel-level RFID tracking for supply chain visibility.