0.05 mm
Min trace/space
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CircuFlex · Wearable & consumer applications
CircuFlex for Wearables & Consumer Electronics
Thin, flexible circuits for smartwatches, true-wireless earbuds, AR/VR, fitness trackers, and connected consumer devices. Miniaturised geometry, cost discipline for high-volume production, and surface-finish options aligned to consumer-grade solderability and aesthetics.
0.065 mm
Min board thickness
0.009 mm
Min Cu foil thickness
High-volume
Production discipline
Overview
Compact FPC for wearable and consumer device programs.
Wearable and consumer electronics run on the bleeding edge of form factor — thinner devices every cycle, more electronics in less space, and consumer price points that force cost discipline from design through supply. CircuFlex is built around thin-FPC manufacturing: 0.065 mm minimum board thickness, 0.009 mm copper foil options, fine-feature geometry, and disciplined high-volume production.
- Thin FPC constructions — 0.065 mm minimum board thickness, 0.0125 mm minimum film
- Fine conductor geometry — 0.05 mm trace/space for dense wearable layouts
- Thin copper options — 0.009 mm minimum for light, flexible constructions
- Cost-disciplined high-volume production
- Surface finish flexibility — Cu, Ni, Au, Sn, OSP
- Profile methods: punching, CNC routing, laser — match geometry and volume
- 100% electrical test; AOI and dimensional inspection per lot
Wearable & consumer capability
Thin, compact, cost-disciplined.
Consumer device programs live or die on volume economics. CircuFlex is engineered around the thin-FPC, fine-feature, high-yield manufacturing that keeps wearable and consumer device programs profitable.
FEATURE 01
Ultra-thin FPC builds
0.065 mm minimum board thickness and 0.0125 mm minimum film thickness — the sub-millimetre construction wearables demand.
FEATURE 02
Fine conductor geometry
0.05 mm trace/space supports dense fan-outs for wearable sensor arrays, earbud audio drivers, and AR/VR display interconnects.
FEATURE 03
Thin copper options
0.009 mm minimum copper foil for applications where flexibility and weight matter more than current-carrying capacity.
FEATURE 04
Cost-disciplined production
Panel utilisation, process route selection, and DFM support — we optimise FPC cost without compromising yield or quality.
FEATURE 05
Volume manufacturing
Disciplined production scheduling, consistent quality output, and reliable delivery at consumer-device volumes.
FEATURE 06
Application-matched finishes
Surface finish selection matches your solderability, visual, and longevity requirements — OSP for cost, ENIG for gold-wire-bond applications.
Technical specifications
Key parameters.
Standard capability envelope. Alternative configurations available on request — send your design brief and we’ll respond with the matching process route.
| Minimum trace/space | 0.05 mm |
|---|---|
| Minimum board thickness | 0.065 mm |
| Minimum film thickness | 0.0125 mm |
| Minimum Cu foil | 0.009 mm |
| Build-up | 1 to 6 layers |
| Maximum panel size | 600 × 500 mm |
| Base films | Polyimide · Polyester |
| Surface finishes | Cu · Ni · Au · Sn · OSP |
| Profile methods | Punching · CNC routing · Laser processing |
| Volume capability | Prototype through high-volume production |
Applications
Where wearable-grade FPC delivers.
SWC
Smartwatches
Display FPC, sensor tails, battery interconnects for wearable watches.
TWE
True-wireless earbuds
Audio driver flex, microphone arrays, charging-case interconnects.
ARV
AR / VR headsets
Display drivers, sensor arrays, and camera interconnects for headsets.
FIT
Fitness & health wearables
Heart-rate, SpO2, motion-sensor FPC for fitness and wellness devices.
HEA
Hearables & smart audio
Hearable electronics, live-translation earpieces, smart-audio interconnects.
RFC
Smart labels & consumer RFID
UHF/HF/NFC inlays and tags for consumer-grade connected products.
Wearables FPC enquiry
Request a wearables FPC review →