IATF 16949-ready
Quality system alignment
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CircuFlex · Automotive applications
CircuFlex for Automotive Electronics
Flex circuits engineered for the automotive reliability envelope — EV battery management, ADAS sensor arrays, cabin electronics, and under-hood telemetry. Process discipline aligned to IATF 16949-style expectations with thermal, humidity, and bend-cycle validation packages.
0.05 mm
Min trace/space
1–6
Layer build-up
Thermal + flex
Validation coverage
Overview
Flex circuits for automotive reliability.
Automotive electronics — especially EV drivetrain, ADAS, and connected-car systems — run in environments that punish flex circuits: thermal cycles, vibration, humidity, and flex fatigue over vehicle lifetime. CircuFlex applies the process discipline and validation framework required by Tier-1 and Tier-2 automotive customers, with documentation aligned to IATF 16949-style expectations.
- Fine-feature capability for compact sensor and ECU interconnects (0.05 mm trace/space)
- Thermal cycling, damp-heat, and flex-fatigue validation packages available
- IATF 16949-style documentation: PPAP-ready evidence, control plans, 8D response
- Polyimide base film for automotive thermal envelope
- Surface finishes aligned to automotive solderability and longevity standards
- 100% electrical test plus dimensional FAI per lot
- Lot-level traceability — material CoC, process records, test results
Automotive capability
Tier-1 ready, Tier-2 practical.
Automotive OEMs and Tier-1s need PPAP-ready documentation, reliable validation data, and disciplined response to field issues. CircuFlex is built around those expectations.
FEATURE 01
IATF 16949-ready documentation
Control plan, PFMEA-aligned process controls, PPAP-ready sample data book — the evidence package Tier-1 SQE teams expect.
FEATURE 02
Thermal + flex validation
Thermal cycling, damp heat, and static-bend / dynamic-flex testing aligned to application environment — validated before PPAP sign-off.
FEATURE 03
Fine-feature for sensors
0.05 mm trace/space and laser drilling for the compact FPC layouts used in ADAS cameras, radar modules, and driver-monitoring systems.
FEATURE 04
Polyimide for thermal envelope
PI base film as default for automotive — proven thermal stability across the -40°C to +125°C automotive envelope.
FEATURE 05
Surface finish per application
Au, Sn, Ni, OSP — selected per application for solderability, longevity, and corrosion resistance in the automotive environment.
FEATURE 06
Lot traceability for recall
Full material-to-lot-to-test traceability — supports the recall and CAPA response expectations of the automotive industry.
Technical specifications
Key parameters.
Standard capability envelope. Alternative configurations available on request — send your design brief and we’ll respond with the matching process route.
| Minimum trace/space | 0.05 mm |
|---|---|
| Minimum laser drill | 0.05 mm |
| Minimum CNC drill | 0.20 mm |
| Build-up | 1 to 6 layers |
| Maximum panel size | 600 × 500 mm |
| Board thickness | 0.065 – 0.28 mm |
| Film thickness | 0.0125 – 0.10 mm |
| Base films | Polyimide (PI) · Polyester |
| Surface finishes | Cu · Ni · Au · Sn · OSP |
| Validation packages | Thermal cycle · Damp heat · Bend fatigue · FAI |
| Electrical test | 100% open/short before release |
Applications
Where automotive-grade FPC delivers.
BMS
EV battery management
Battery-pack-level interconnects for cell-monitoring, temperature-sensing, and BMS electronics in electric drivetrains.
ADS
ADAS sensor arrays
Camera, radar, and lidar module flex interconnects for driver-assistance systems.
ECU
ECU & body electronics
Compact ECU interconnects and body-electronics flex cables for cabin systems.
TEL
Powertrain telemetry
Under-hood sensor tails for engine management, transmission, and aftertreatment systems.
TPM
Tyre pressure monitoring
TPMS sensor electronics and interconnects.
IVI
Infotainment & displays
Display flex cables, head-unit interconnects, and in-vehicle infotainment assemblies.
Automotive FPC enquiry
Request an automotive FPC review →