Flexible printed circuits engineered for medical-grade reliability — hearing aids, wearable sensors, surgical instruments, and implant-adjacent electronics. Fine-trace capability, lot-level traceability, and documentation discipline aligned to medical-device qualification standards.
Medical device manufacturers need flexible circuits that match three demands at once: fine geometry for miniaturised form factors, rigorous process documentation for qualification audits, and lot-level traceability for post-market surveillance. CircuFlex is built around those demands. Fine trace/space (0.05 mm), laser drilling to 0.05 mm, and a quality system aligned to ISO 13485-style documentation discipline.

Every feature listed has a medical-qualification rationale — fine geometry for miniaturisation, documentation for audit, traceability for CAPA response.
0.05 mm trace/space and 0.05 mm laser drilling — supports the compact layouts typical of hearing aids, wearable sensors, and implant-adjacent interconnects.
Polyimide (PI) base film as the default medical substrate — thermally stable, biocompatibility-grade variants available, proven in long-service medical applications.
Material certificates of compliance, lot-linked process records, and electrical test results retained per lot — ready for post-market surveillance and CAPA response.
Audit file, control plan, sample data book, reliability gate, 8D response — the evidence package aligned to ISO 13485-style qualification.
Gold (Au), tin (Sn), nickel (Ni), and OSP surface finishes — match solderability, longevity, and biocompatibility to application.
Open/short testing before release — supports the zero-escape expectation of medical-device assembly.
Standard capability envelope. Alternative configurations available on request — send your design brief and we’ll respond with the matching process route.
| Minimum trace/space | 0.05 mm |
|---|---|
| Minimum laser drill | 0.05 mm |
| Minimum CNC drill | 0.20 mm |
| Build-up | 1 to 6 layers |
| Maximum panel size | 600 × 500 mm |
| Board thickness | 0.065 – 0.28 mm |
| Film thickness | 0.0125 – 0.10 mm |
| Copper foil thickness | 0.009 – 0.10 mm |
| Base films | Polyimide (PI) · Polyester |
| Surface finishes | Cu · Ni · Au · Sn · OSP |
| Profile methods | Punching · CNC routing · Laser processing |
| Electrical test | 100% open/short before release |
Compact in-ear FPC assemblies where size and reliability are non-negotiable.
Single-use and re-usable surgical device interconnects with documented traceability.
ECG patches, glucose monitors, and continuous-monitoring wearables.
FPC constructions supporting implantable and body-adjacent device programmes.
Bench-top and handheld diagnostic equipment FPC interconnects.
Electronic-assisted drug delivery and infusion device flex circuits.